W9425G6EH
7.10.3 CAS Latency field (A6 to A4)................................................................................................16
7.10.4 DLL Reset bit (A8) ................................................................................................................16
7.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ........................................16
7.10.6 Extended Mode Register field ..............................................................................................16
7.10.7 Reserved field ......................................................................................................................17
8.
OPERATION MODE ....................................................................................................................................18
8.1
8.2
8.3
8.4
Simplified Truth Table ......................................................................................................................18
Function Truth Table ........................................................................................................................19
Function Truth Table for CKE...........................................................................................................22
Simplified Stated Diagram ................................................................................................................23
9.
ELECTRICAL CHARACTERISTICS ............................................................................................................24
9.1
9.2
9.3
9.4
9.5
9.6
9.7
Absolute Maximum Ratings..............................................................................................................24
Recommended DC Operating Conditions ........................................................................................24
Capacitance .....................................................................................................................................25
Leakage and Output Buffer Characteristics......................................................................................25
DC Characteristics ...........................................................................................................................26
AC Characteristics and Operating Condition ....................................................................................27
AC Test Conditions ..........................................................................................................................28
10.
SYSTEM CHARACTERISTICS FOR DDR SDRAM.....................................................................................31
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
Table 1: Input Slew Rate for DQ, DQS, and D M .............................................................................31
Table 2: Input Setup & Hold Time Derating for Slew Rate ...............................................................31
Table 3: Input/Output Setup & Hold Time Derating for Slew Rate....................................................31
Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate ....................................31
Table 5: Output Slew Rate Characteristics (X16 Devices only)........................................................31
Table 6: Output Slew Rate Matching Ratio Characteristics ..............................................................32
Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins..............................32
Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins...............................33
System Notes: ..................................................................................................................................34
11.
TIMING WAVEFORMS ................................................................................................................................36
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
Command Input Timing ....................................................................................................................36
Timing of the CLK Signals ................................................................................................................36
Read Timing (Burst Length = 4) .......................................................................................................37
Write Timing (Burst Length = 4) .......................................................................................................38
DM, DATA MASK (W9425G6EH).....................................................................................................39
Mode Register Set (MRS) Timing.....................................................................................................40
Extend Mode Register Set (EMRS) Timing ......................................................................................41
Auto-precharge Timing (Read Cycle, CL = 2) ..................................................................................42
Auto-precharge Timing (Read cycle, CL = 2), continued..................................................................43
11.10 Auto-precharge Timing (Write Cycle) ...............................................................................................44
Publication Release Date:Dec. 03, 2008
-2-
Revision A08
相关PDF资料
W9425G6JH-5I IC DDR SDRAM 256MBIT 66TSOPII
W947D2HBJX5E IC LPDDR SDRAM 128MBIT 90VFBGA
W948D2FBJX5E IC LPDDR SDRAM 256MBIT 90VFBGA
W949D2CBJX5E IC LPDDR SDRAM 512MBIT 90VFBGA
W971GG6JB25I IC DDR2 SDRAM 1GBIT 84WBGA
W971GG8JB-25 IC DDR2 SDRAM 1GBIT 60WBGA
W9725G6IB-25 IC DDR2-800 SDRAM 256MB 84-WBGA
W9725G6JB25I IC DDR2 SDRAM 256MBIT 84WBGA
相关代理商/技术参数
W9425G6EH-5I 制造商:Winbond Electronics Corp 功能描述:
W9425G6JB-5 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin TFBGA 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY 制造商:Winbond 功能描述:16MX16,256Mb DDRI DRAM ,200MHZ, BGA
W9425G6JB-5 TR 制造商:Winbond Electronics Corp 功能描述:256M DDR SDRAM X16, 200MHZ
W9425G6JB-5I 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY
W9425G6JB-5I TR 制造商:Winbond Electronics Corp 功能描述:256M DDR SDRAM X16, 200MHZ, IN
W9425G6JH 制造商:WINBOND 制造商全称:Winbond 功能描述:4 M × 4 BANKS × 16 BITS DDR SDRAM
W9425G6JH-4 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 66-Pin TSOP-II 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY 制造商:Winbond 功能描述:16MX16,256MB DDR,250MHZ,2.5V , TSOP 66PIN GREEN
W9425G6JH4TR 制造商:Winbond Electronics Corp 功能描述:256M DDR SDRAM X16, 250MHZ, 65